Cell Lab Porous Copper Foam Sheet [300 × 200 × 0.2 mm, 99.99% Purity, 100 PPI] – Ultra-Conductive 3D Substrate

Cell Lab Porous Copper Foam Sheet [300 × 200 × 0.2 mm, 99.99% Purity, 100 PPI] – Ultra-Conductive 3D Substrate for Battery, Supercapacitor & Catalysis Research

High-purity porous copper substrate for advanced electrochemical and thermal management applications

The Cell Lab Porous Copper Foam Sheet is an ultra-conductive metallic substrate designed to support next-generation battery, supercapacitor, and catalytic systems. Made from ≥99.99% pure copper, this material features an interconnected 3D porous network (100 PPI) that ensures superior electrical and thermal conductivity, while enabling efficient electrolyte penetration and in-situ electrode material growth.

Its lightweight open-cell structure provides a large active surface area, facilitating charge transport and gas diffusion in energy storage and conversion devices. Additionally, it serves as an excellent heat sink, catalyst carrier, or structural scaffold in various electrochemical and thermal research applications.

Key Features

Ultra-High Conductivity
Delivers outstanding electronic and thermal conductivity for efficient charge transfer and heat dissipation.

Hierarchical Porous Structure (100 PPI)
3D interconnected network supports superior electrolyte diffusion and active material adhesion.

High-Purity Copper (≥99.99%)
Minimises impurities, ensuring stable electrochemical performance and repeatable test results.

Versatile Functional Applications
Ideal for lithium-ion batteries, supercapacitors, fuel cells, and catalytic reaction systems.

Customisable Size & Thickness
Standard sheet size 300 × 200 × 0.2 mm; thickness, porosity, and surface finish can be tailored upon request.

Technical Specifications

Applications & Industries

• Lithium-ion and sodium-ion battery current collectors

• Supercapacitor and electrochemical capacitor electrodes

• Fuel cell and catalytic substrate systems

• Graphene and nanomaterial deposition scaffolds

• Heat sink and thermal management in electronic systems

FAQ

Q1: What makes porous copper foam suitable for electrochemical systems?
Its 3D porous structure enhances ion diffusion, charge transfer, and material loading for improved device performance.

Q2: Can it be used directly as a current collector?
Yes. It can serve as a 3D current collector for in-situ electrode growth and electrochemical testing.

Q3: Does the foam require cleaning before use?
Due to natural oxidation, a gentle clean with diluted acid or ethanol is recommended prior to use.

Q4: Can pore size and thickness be customised?
Yes. Both parameters can be adjusted according to research requirements or device specifications.

Q5: Is it compatible with high-temperature processes like CVD?
Yes. Its high melting point and chemical stability make it ideal for CVD, pyrolysis, and high-temperature synthesis.