High-purity 99.999% copper sputtering target for electronic, optical, and photovoltaic coatings. Offers superior conductivity, adhesion, and uniform thin-film performance.
High-purity 99.999% copper sputtering target for electronic, optical, and photovoltaic coatings. Offers superior conductivity, adhesion, and uniform thin-film performance.

Cell Lab 4N5 (99.995%) Copper (Cu) Sputtering Target

Cell Lab 4N5 (99.995%) Copper (Cu) Sputtering Target High-Conductivity Copper Target for Thin Film Deposition and Electronic Applications General Description Cell Lab 4N5 (99.995%) Copper Sputtering Target is a high-purity metallic target engineered for semiconductor, microelectronic, and optical thin-film applications....
Vendor: Cell Lab
SKU: ST0200
Product type: Sputtering Targets
£59.00
£59.00
Choose your size to determine pricing for each.: 1.0" Dia. x 0.125" Thick
Choose Option for Purity: 99.99%
Subtotal: £59.00
High-purity 99.999% copper sputtering target for electronic, optical, and photovoltaic coatings. Offers superior conductivity, adhesion, and uniform thin-film performance.

Cell Lab 4N5 (99.995%) Copper (Cu) Sputtering Target

£59.00
High-purity 99.999% copper sputtering target for electronic, optical, and photovoltaic coatings. Offers superior conductivity, adhesion, and uniform thin-film performance.

Cell Lab 4N5 (99.995%) Copper (Cu) Sputtering Target

£59.00
Choose your size to determine pricing for each.: 1.0" Dia. x 0.125" Thick
Choose Option for Purity: 99.99%
Description
Description
x

Cell Lab 4N5 (99.995%) Copper (Cu) Sputtering Target

High-Conductivity Copper Target for Thin Film Deposition and Electronic Applications

General Description

Cell Lab 4N5 (99.995%) Copper Sputtering Target is a high-purity metallic target engineered for semiconductor, microelectronic, and optical thin-film applications. Copper is a reddish-orange, ductile, and malleable transition metal known for its exceptional electrical and thermal conductivity.
In sputtering processes, it is widely used to deposit conductive layers, seed films, and reflective coatings across various industries including MEMS fabrication, data storage, and advanced circuitry.

Key Features

  • Ultra-High Purity (99.995%) – Reduces oxygen and sulfur contamination, ensuring consistent conductivity.

  • Excellent Conductive Properties – Ideal for electrodes, interconnects, and transparent conductive coatings.

  • Superior Film Adhesion – Ensures dense, uniform, and highly conductive thin films.

  • Versatile Sputtering Compatibility – Suitable for DC, RF, and magnetron sputtering systems.

  • Customisable Options – Dimensions, bonding types, and purity grades (4N–5N) available upon request.

Technical Specifications

Parameter Specification
Material Type Copper
Symbol Cu
Atomic Number 29
Atomic Weight 63.546
Density 8.96 g/cm³
Melting Point 1,083 °C
Boiling Point 2,567 °C
Crystal Structure Cubic
Colour/Appearance Red/Orange, Metallic
Purity 99.99%, 99.995%
Thermal Conductivity 400 W/m·K
Coefficient of Thermal Expansion 16.5 × 10⁻⁶ /K
Sputtering Method DC or Magnetron

Applications & Industries

  • Microelectronics – Conductive interconnects, integrated circuits, and seed layers.

  • Photovoltaics – Back electrodes and contact layers in thin-film solar cells.

  • Optics – Reflective and decorative coatings with excellent adhesion.

  • Data Storage – Thin conductive layers for HDDs and magnetic components.

  • Aerospace & Defence – Corrosion-resistant conductive coatings for components.

FAQ

Q1: Can copper targets be used in reactive sputtering environments?
Yes, but inert gas environments (Ar) are preferred to maintain purity and prevent oxide formation.

Q2: What bonding options are available?
Cell Lab offers indium-bonded copper backing plates for improved thermal management.

Q3: Is the 5N purity necessary for all applications?
For high-performance electronics and semiconductor coatings, 5N purity ensures minimal contamination and superior conductivity.

Q4: Are custom dimensions available?
Yes. We provide custom diameters, thicknesses, and shapes for compatibility with all major sputtering systems.

Shipping & Return
Shipping & Return
x

Returns Policy

You may return most new, unopened items within 30 days of delivery for a full refund. We'll also pay the return shipping costs if the return is a result of our error (you received an incorrect or defective item, etc.).

You should expect to receive your refund within four weeks of giving your package to the return shipper, however, in many cases you will receive a refund more quickly. This time period includes the transit time for us to receive your return from the shipper (5 to 10 business days), the time it takes us to process your return once we receive it (3 to 5 business days), and the time it takes your bank to process our refund request (5 to 10 business days).

If you need to return an item, simply login to your account, view the order using the "Complete Orders" link under the My Account menu and click the Return Item(s) button. We'll notify you via e-mail of your refund once we've received and processed the returned item.

Shipping

We can ship to virtually any address in the world. Note that there are restrictions on some products, and some products cannot be shipped to international destinations.

When you place an order, we will estimate shipping and delivery dates for you based on the availability of your items and the shipping options you choose. Depending on the shipping provider you choose, shipping date estimates may appear on the shipping quotes page.

Please also note that the shipping rates for many items we sell are weight-based. The weight of any such item can be found on its detail page. To reflect the policies of the shipping companies we use, all weights will be rounded up to the next full pound.

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